单板电脑
不断电主板

3I110HW / 3I110BW

3.5" Plus SBC 支持 Intel® 11th Gen Tiger Lake-UP3,
i7 / i5 / i3 / Celeron CPU, VGA, HDMI (or DP),
eDP / LVDS, 3 x Intel Gb Ethernet,
Audio, 2 x M.2, Touch Screen controller, 4DI / 4DO, 6 x USB,
4 x COM, 1 x Mini PCIe, 1 x SIM, Battery Charger, SMBus

概览

LEX SYSTEM 3.5” 工业嵌入式主板3I110HW/BW 配备第11 代Intel® Tiger Lake-UP3 i7/i5/i3/Celeron 处理器,专为边缘视觉运算而设计。全新整合的高效能、低功耗SoC,更结合AI加速功能,进一步提升边缘运算中 AI人工智慧的效能,轻松、精准地处理电脑视觉、高工作负载等复杂运算的应用。3I110HW/BW, 配备 3 x GbE, 4 x RS232/RS422/485 串口, 7 x USB, 4 DI /4 DO, DP, HDMI ,VGA & LVDS with 1 x mPCIe, 2 x M.2 and 1 x SIM 扩展槽。 3I110HW/BW 的全針腳I/O端子 设计为扩展功能提供了高度的灵活性,并且还为用户提供了将 SBC 板集成到各种机械外壳中的无忧解决方案。加上电池充电器功能,该平台非常适合可靠性和移动性受限的 AIoT 应用,例如医疗视频分析、智能交通、工厂自动化和边缘 AI 解决方案。

 

 

特点

  • 11th Gen Intel® Tiger Lake-UP3,
    i7 / i5 / i3 / Celeron CPU
  • 2 x DDR4 SODIMM (Max. 64GB)
  • Multiple Independent display:
    VGA, HDMI (or DP), eDP or LVDS
  • 3 x Intel GbE LAN, 6 x USB 2.0
  • 4 x COM, 4DI / 4DO, 1 x Mini PCIe, 1 x SIM
  • 1 x M.2 B Key, 1 x M.2 M Key
  • TPM 2.0 (Firmware), SMBus
  • Battery Charger Function (3I110BW)
  • OEM Option:
    DP (Type C),
    1 x PCIe x 1 (Type C*)
    *LEX-defined Type C pin configuration

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MODEL 3I110HW / 3I110BW
CPU Type Intel® Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU
MB Chipset Intel® Tiger Lake-UP3 SoC
Graphics Intel® Iris® Xe Graphics and media encode / decode engine
Intel® UHD Graphics, Support DirectX 12 & OpenGL 4.5
System Memory 2 x DDR4 SODIMM, Max 64GB
Storage 2 x SATA ports 3.0 Data transfer rates up to 6.0 Gb/s (600 MB/s)
1 x M.2 B key Type 3042 (PCIe x2 / mSATA / USB 3.0 / 2.0)-share SATA2
1 x M.2 M key Type 2280 (PCIe x4), Support NVMe
BIOS AMI UEFI BIOS
Display 1 x VGA, 1 x HDMI (or DP), eDP or Dual Channel, 48 bits LVDS
Touch USB touch screen controller
TPM TPM 2.0 (Firmware) ; OEM Optional to Hardware TPM
LAN 1 x Intel GbE I219LM (internal)
2 x Intel 2.5 GbE I225-IT (internal) w/Core CPU or 2X I225-V w/Celeron CPU
Audio High Definition Audio Specification, Support Line-out / Mic-in / Line-in
Two channel Class D Audio Amplifier
Expansion Interface 1 x Full size Mini PCIe (PCIe / USB 2.0)
1 x M.2 B key Type 3042 (PCIe x2 / mSATA / USB 3.0 / 2.0)
1 x M.2 M key Type 2280 (PCIe x4), Support NVMe
1 x SIM
Expansion Options

CN064 : M.2 B key 2242 to M.2 E Key 2230, WiFi 6 + BT
CN067 : M.2 B key 2242 to M.2 B Key 2252, 4G / 5G (3.7V by BOM Control)
CN059 : USB to Line-out / Mic- in
CC007 : USB to 4 port COM
CIO116G : SMBus to 8DI + 8DO
PW351 : 1 port PoE PSE
PW352 : 2 port PoE PSE
PW301 : 802.3AF / AT PD module
PW205 : Wide Range power board (9~36V) with power Ignition on/off delay
PW206 : 12V / 24V DC to DC Redundant Power Board
PW022 : Wide Range power board (24V / 48V)
DP001 : eDP to VGA  
eDP003 : eDP to DVI  
eDP004 : eDP to HDMI
eDP001 : eDP to LVDS (OEM)

USB 6 x USB 2.0 (internal)
Serial IO

4 x RS232 / 422 / 485 (internal)

*COM1~COM4 pin9 5V / 12V (Option)

GPIO Hardware digital Input & Output, 4 x DI / 4 x DO
SMBus 1 x SMBus
WDT Hardware Watch Dog Timer, 0~255 sec programmable
Power Input Wide Range +9~36V ; Battery Charger function (3I110BW)
Dimension 3.5" Plus (146 x 115 mm) ; Weight: 138g
Operation Temperature
(100 % CPU Usage)
-40°C~+70°C (Core i GRE series CPU)
-20°C~+70°C (Core i G7E / G7 series CPU)
Operation Humidity 5~95%, non-condensing
Chassis (OEM I/O Expansion by request) Windows® 10 IOT ; Windows® 11 IOT
Ubuntu 22.04 above, Fedora 36 above
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