不断电主板
3I110HW + Hailo-8™ AI module
i7 / i5 / i3 / Celeron CPU, VGA, HDMI (or DP),
eDP / LVDS, 3 x Intel Gb Ethernet,
Audio, 2 x M.2, Touch Screen controller, 4DI / 4DO, 6 x USB,
4 x COM, 1 x Mini PCIe, 1 x SIM, Battery Charger, SMBus,
Pre-installed Mini PCIe / M.2 Hailo-8™ AI Accelerator
概览
LEX SYSTEM 3.5” 工业嵌入式主板3I110HW/BW 配备第11 代Intel® Tiger Lake-UP3 i7/i5/i3/Celeron 处理器,专为边缘视觉运算而设计。全新整合的高效能、低功耗SoC,更结合AI加速功能,进一步提升边缘运算中 AI人工智慧的效能,轻松、精准地处理电脑视觉、高工作负载等复杂运算的应用。3I110HW/BW, 配备 3 x GbE网口, 4 x RS232/RS422/485 串口, 7 x USB, 4 DI /4 DO, DP, HDMI ,VGA & LVDS with 1 x mPCIe, 2 x M.2 and 1 x SIM 扩展槽。
此外,通过采用M.2 或Mini PCIe插槽,3I110HW/BW可以轻松安装用于AI应用的Hailo-8™ AI加速模块。通过与 3I110HW/BW的高度兼容性,Hailo-8™ 边缘人工智能模块能最大限度地发挥边缘人工智能运算能力并帮助客户加快上市时间。3I110HW/BW 与 Hailo-8™ 模块的配对使开发人员能够以較低功耗运行复杂的深度学习和机器视觉应用程序。
3I110HW/BW 的全針腳I/O端子 设计为扩展功能提供了高度的灵活性,并且还为用户提供了将 SBC 板集成到各种机械外壳中的无忧解决方案。加上电池充电器功能,该平台非常适合可靠性和移动性受限的 AIoT 应用,例如医疗视频分析、智能交通、工厂自动化和边缘 AI 解决方案。
特点
- 11th Gen Intel® Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU
- Pre-installed Mini PCIe / M.2 Hailo-8™ AI Accelerator
- 2 x DDR4 SODIMM (Max. 64GB)
- Multiple Independent display:
VGA, HDMI (or DP), eDP or LVDS - 3 x Intel GbE LAN, 6 x USB 2.0
- 4 x COM, 4DI / 4DO, 1 x Mini PCIe, 1 x SIM
- 1 x M.2 B Key, 1 x M.2 M Key
- TPM 2.0 (Firmware), SMBus
- Battery Charger Function (3I110BW)
- OEM Option:
DP (Type C),
1 x PCIe x 1 (Type C*)
*LEX-defined Type C pin configuration
MODEL | 3I110HW + Hailo-8™ AI module |
---|---|
CPU Type | Intel® Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU |
MB Chipset | Intel® Tiger Lake-UP3 SoC |
Graphics | Intel® Iris® Xe Graphics and media encode / decode engine Intel® UHD Graphics, Support DirectX 12 & OpenGL 4.5 |
System Memory | 2 x DDR4 SODIMM, Max 64GB |
Storage | 2 x SATA ports 3.0 Data transfer rates up to 6.0 Gb/s (600 MB/s) 1 x M.2 B key Type 3042 (PCIe x2 / mSATA / USB 3.0 / 2.0)-share SATA2 1 x M.2 M key Type 2280 (PCIe x4), Support NVMe |
BIOS | AMI UEFI BIOS |
Display | 1 x VGA, 1 x HDMI (or DP), eDP or Dual Channel, 48 bits LVDS |
Touch | USB touch screen controller |
TPM | TPM 2.0 (Firmware) ; OEM Optional to Hardware TPM |
LAN | 1 x Intel GbE I219LM (internal) 2 x Intel 2.5 GbE I225-IT (internal) w/Core CPU or 2X I225-V w/Celeron CPU |
Audio | High Definition Audio Specification, Support Line-out / Mic-in / Line-in Two channel Class D Audio Amplifier |
Expansion Interface | 1 x Full size Mini PCIe (PCIe / USB 2.0) 1 x M.2 B key Type 3042 (PCIe x2 / mSATA / USB 3.0 / 2.0) 1 x M.2 M key Type 2280 (PCIe x4), Support NVMe 1 x SIM |
Expansion Options |
CN064 : M.2 B key 2242 to M.2 E Key 2230, WiFi 6 + BT |
USB | 6 x USB 2.0 (internal) |
Serial IO |
4 x RS232 / 422 / 485 (internal) *COM1~COM4 pin9 5V / 12V (Option) |
GPIO | Hardware digital Input & Output, 4 x DI / 4 x DO |
SMBus | 1 x SMBus |
WDT | Hardware Watch Dog Timer, 0~255 sec programmable |
Power Input | Wide Range +9~36V ; Battery Charger function (3I110BW) |
Dimension | 3.5" Plus (146 x 115 mm) |
Operation Temperature (100 % CPU Usage) |
-40°C~+70°C (Core i GRE series CPU) -20°C~+70°C (Core i G7E / G7 series CPU) |
Operation Humidity | 5~95%, non-condensing |
Chassis (OEM I/O Expansion by request) | Windows® 10 IOT ; Windows® 11 IOT Ubuntu 22.04 above, Ubuntu 22.04 host OS, Hailo SW via Ubuntu container |